Design And Reuse, The Web's System On Chip Design Resource : catalogs of IPs, Virtual Components, Cores for designing System-on-Chip (SOC)

Since its inception, BCD technology has leveraged the integration of two primary technologies—polysilicon gate CMOS and DMOS power architecture—on the same chip. Its compatibility with bipolar components has enabled the creation of SoCs (System-on-Chip) that combine digital and analog control with efficient power management sections.

VLSI Also called: Very Large-Scale Integration. VLSI (Very Large-Scale Integration) is the process of placing thousands (or hundreds of thousands) of electronic components on a single chip.

The relentless march towards shrinking technology nodes has ushered in a new era of intricate semiconductor designs characterized by a proliferation of transistors. This intensifying complexity brings with it heightened criticality in various aspects of chip design and manufacturing. As each day dawns, innovative techniques and methodologies emerge to tackle these burgeoning challenges and ...

by Ramesh Chandra, STMicroelectronics, Inc San Diego, USA ABSTRACT Prevailing IP-Reuse methodologies are based on sharing designs at either Physical level called Hard-IP or at RTL level using HDL models called Soft-IP. Design re-use based on RTL based Soft-IP has been in use for many years now with limited success in certain domains.

3.3V to 1.2V with 150mA driving capability without external capacitor(Cap-less); use trimming ports (need e-Fuse IP); Linear Regulator; UMC 55nm eFlash LowK Logic Process 3.3V to 2.0V with 288mA driving capability with external capacitor,use trimming ports (need e-Fuse IP); Linear Regulator; UMC ...

D&R provides the world's largest directory of Silicon IP (Intellectual Property), SoC Configurable Design Platforms and SOPC Products from 400 vendors

Mitul Soni, Gourav Kapoor,Nikhil Wadhwa,Nalin Gupta (Freescale Semiconductor India Pvt. Ltd.)Design Rule violation is one of the major challenges being faced by VLSI industry. With ever shrinking technology nodes, and ever increasing gate counts, reaching to more than 40 million on a single die, the complexity of the design is momentous!

Power management of battery-powered electronic devices is becoming increasingly more important for the present and future microelectronics industry. This application note details the difference between low dropout (LDO) voltage regulators that use output capacitance and those that do not and how your system designs can benefit from …

Dec 5, 2024 · Advanced Packaging for Mass Markets lowers packaging costs enabling Mass Market deployment. SAN RAMON, CA, UNITED STATES, December 5, 2024 -- YorChip, Inc. and Digitho extend partnership to develop a breakthrough 2D low cost advanced Chiplet Packaging solution.Currently advanced packaging is too expensive and unsuitable for mass market applications as packaging costs can easily exceed silicon ...